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The ET-501P is a dedicated production machinedesigned to eutectically bond the submount and chip(LD) onto a TO56 header through a controlled heating process.
ET-503 25G Base Assembly DieBonder is designed for the eutectic assembly of 25G TO56 and TO60 bases with large heat sinks. This automated production system bonds multiple solder preforms between the 25G large heat sink and the TO56 or TO60 base through co
PH-550P is a eutectic bonding machineused in COB and COC processes. It bonds the substrate and chip by melting solder according to a controlled temperature profile after CCD-based positioning.The system is primarily composed of a eutectic bonding stage, c
1, PH-100是COC等制程中将耐高温基底与芯片，经过控制温度曲线熔化焊料从而键合在一-起的共晶设备。 2,设备主要由共晶台，贴片吸嘴组件，对位CCD，脉冲加热系统等组成。 3,共晶台包含X、Y、T三轴系统组成，上面设置共晶加热模块，冷氮气环境保护系统，共晶台冷却系统。 4,贴片吸嘴组件设在Z轴上……
RD-800 is a fully automatic multifunctional die bonder designed for high-precision multi-chip placement in packaging processes.
RD-3000 is a versatileeutectic die bondersuitable for adhesiveand eutectic chip packaging processes.● Automatic nozzle change mechanism.● Air-floating bonding head mechanism to ensure placement accuracy and consistent bonding pressure.● Compatible with cl
● Supports placement of multiple chip types simultaneously● Equipped with an auto-zoom motorized lens to accommodate different component sizes● Programmable operation for various process requirements
The substrate is manually placed into the substrate fixture, which is then loaded into the automatic loading/unloading magazine. Chip trays or blue tapes are also manually loaded.
DB-560P is a production machinedesigned for COB/COC processes, bonding substrates (PCBs or other materials) to chips using an automated dispensing process.Manual Loading:Place the substrate tray into the feed cassette, then install the cassette onto the c
This machineis an automated production system designed to bond TO sockets to chips through a dispensing process after rotating the TO sockets to a specified angle (Ɵ) during the manufacturing process.Manual Loading:Place the TO socket strips into the carr
设备简介： 应用：IGBT及其它金属零件焊接 功能优势： 实现IGBT端子全自动焊接工序。 包含焊前清洁，焊后清洁。 实现自动上下料，可连续工作。 图像处理功能，保证焊接位置准确性及实现自动焊接。 焊接压力70~2000N，焊接功率最大4000W。 可精确动态力控……
● Utilizes an ultrasonic welding process optimized for pins – torque welding process. ● Full-process monitoring of pressure, energy, and time ensures welding quality. ● Automatic loading/unloading, automatic alignment, and automatic welding. ● In