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Fully Automatic Multi-Function Die Bonder
RD-3000 is a versatile eutectic die bonder suitable for adhesive and eutectic chip packaging processes.● Automatic nozzle change mechanism.
● Air-floating bonding head mechanism to ensure placement accuracy and consistent bonding pressure.
● Compatible with clip carriers, waffle trays, blue film, and feeder supply systems.
● Substrate carriers are supplied via conveyor line; carriers are compatible with sensitive substrates sized 200 × 300 mm.
● Optional multi-zone heating platform.
● Supports die attach with adhesive dipping and dispensing; up to three glue trays can be accommodated.
● Front and back side chip recognition, suitable for both face-up and flip-chip processes.
● Production process is programmable to accommodate multiple materials and process requirements.
● Graphical recognition is programmable to meet precise alignment and inspection needs.
● Supports 12-inch and 8-inch wafers, including die singulation, rotation, and barcode scanning.
● Dimensions: 1510 × 1620 × 2200 mm
● Weight: 2600 kg
● Placement Accuracy: 3 µm, ±0.1°
● Wafer Size: 12”
● Substrate Size: Length 100–300 mm, Width 50–200 mm, Height 0.08–1 mm
● Air Pressure: 0.4–0.6 MPa
● Die Attach Pressure: 10–500 g
● Nozzle stock quantity: 8