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RD-800 is a fully automatic multifunctional die bonder designed for high-precision multi-chip placement in packaging processes.
RD-3000 is a versatileeutectic die bondersuitable for adhesiveand eutectic chip packaging processes.● Automatic nozzle change mechanism.● Air-floating bonding head mechanism to ensure placement accuracy and consistent bonding pressure.● Compatible with cl
● Supports placement of multiple chip types simultaneously● Equipped with an auto-zoom motorized lens to accommodate different component sizes● Programmable operation for various process requirements
The substrate is manually placed into the substrate fixture, which is then loaded into the automatic loading/unloading magazine. Chip trays or blue tapes are also manually loaded.
DB-560P is a production machinedesigned for COB/COC processes, bonding substrates (PCBs or other materials) to chips using an automated dispensing process.Manual Loading:Place the substrate tray into the feed cassette, then install the cassette onto the c
This machineis an automated production system designed to bond TO sockets to chips through a dispensing process after rotating the TO sockets to a specified angle (Ɵ) during the manufacturing process.Manual Loading:Place the TO socket strips into the carr