Products

Fully Automatic TO56 Eutectic Bonder ET-501P

The ET-501P is a dedicated production machinedesigned to eutectically bond the submount and chip(LD) onto a TO56 header through a controlled heating process.

TO Base Assembly Die Bonder 25G ET-503

ET-503 25G Base Assembly DieBonder is designed for the eutectic assembly of 25G TO56 and TO60 bases with large heat sinks. This automated production system bonds multiple solder preforms between the 25G large heat sink and the TO56 or TO60 base through co

Fully Automatic Pulse-Heating Eutectic Bonder PH-550P

PH-550P is a eutectic bonding machineused in COB and COC processes. It bonds the substrate and chip by melting solder according to a controlled temperature profile after CCD-based positioning.The system is primarily composed of a eutectic bonding stage, c

Manual pulse heating eutectic machine

1, PH-100是COC等制程中将耐高温基底与芯片，经过控制温度曲线熔化焊料从而键合在一-起的共晶设备。2,设备主要由共晶台，贴片吸嘴组件，对位CCD，脉冲加热系统等组成。3,共晶台包含X、Y、T三轴系统组成，上面设置共晶加热模块，冷氮气环境保护系统，共晶台冷却系统。4,贴片吸嘴组件设在Z轴上，Z轴用于控制贴片高度，……

PH-100